Package and PCB Effects Shift Intermodulation Notch in an RF Common-Emitter Amplifier
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Date
2014-04
Authors
ORCID
Advisor
Referee
Mark
Journal Title
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Publisher
Společnost pro radioelektronické inženýrství
Abstract
A Taylor series analysis is conducted to study the effects of the package and printed circuit board (PCB) on the intermodulation nulling of an RF common-emitter amplifier. The equivalent parasitic element of the package and PCB interconnects is extracted from the impedance and admittance parameters, which are obtained using a three-dimensional (3-D) electromagnetic simulation tool. The theoretical analysis reveals that the effects of the package and PCB on the intermodulation nulling of common-emitter amplifiers is to shift the intermodulation notch; that the third-order intermodulation (IM3) products under an original bias condition cannot be suppressed and that the linearity of common-emitter amplifiers is thereby degraded. A comparison between theory and simulation reveals good agreement in the predicted locations of the intermodulation notch in the absence and presence of a package and PCB.
Description
Citation
Radioengineering. 2014, vol. 23, č. 1, s. 229-235. ISSN 1210-2512
http://www.radioeng.cz/fulltexts/2014/14_01_0229_0235.pdf
http://www.radioeng.cz/fulltexts/2014/14_01_0229_0235.pdf
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Peer-reviewed
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Published version
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en