Analysis of Application Flux and Solder Paste on PCB for BGA Components
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Date
2016
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Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract
This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.
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Citation
Proceedings of the 22nd Conference STUDENT EEICT 2016. s. 203-205. ISBN 978-80-214-5350-0
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
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cs
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© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií