Design Of Reflow Soldering Station For Reballing Of Bga Packages

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but.event.date26.04.2018cs
but.event.titleStudent EEICT 2018cs
dc.contributor.authorJaniš, Adam
dc.date.accessioned2019-03-04T10:05:37Z
dc.date.available2019-03-04T10:05:37Z
dc.date.issued2018cs
dc.description.abstractThis article deals with the design of a soldering oven for BGA reballing in a nitrogen atmosphere. The principles of reflow soldering, the advantages of a nitrogen atmosphere regarding the quality of solder joints and the types of soldering devices are described. The main aim of the experimental part is to design the soldering station and to simulate the heat flow during soldering using SolidWorks Flow Simulation. Final stage of this work is based on verification of designed soldering station and optimization of soldering process.en
dc.formattextcs
dc.format.extent82-84cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationProceedings of the 24th Conference STUDENT EEICT 2018. s. 82-84. ISBN 978-80-214-5614-3cs
dc.identifier.isbn978-80-214-5614-3
dc.identifier.urihttp://hdl.handle.net/11012/138175
dc.language.isoczcs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 24th Conference STUDENT EEICT 2018en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.rights.accessopenAccessen
dc.subjectreflow ovenen
dc.subjectBGAen
dc.subjectreballingen
dc.subjectnitrogen protective atmosphereen
dc.titleDesign Of Reflow Soldering Station For Reballing Of Bga Packagesen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
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