Usage Of Solders With Higher Melting Point For Hybrid Integrated Circuits

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but.event.date26.04.2018cs
but.event.titleStudent EEICT 2018cs
dc.contributor.authorJanda, Ondřej
dc.date.accessioned2019-03-04T10:05:36Z
dc.date.available2019-03-04T10:05:36Z
dc.date.issued2018cs
dc.description.abstractThis article deals with the advantages of brazing that uses an experimental tool for heat conduction, which can be used in thick film technology. In present days brazing on thick film is used in a few applications in microelectronic industry. At higher soldering temperatures there is also an increase in demands leading to creation of high quality joints. The joints made by brazing are mainly used for special applications for power electronics, heating elements and temperature or other sensors.en
dc.formattextcs
dc.format.extent79-81cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationProceedings of the 24th Conference STUDENT EEICT 2018. s. 79-81. ISBN 978-80-214-5614-3cs
dc.identifier.isbn978-80-214-5614-3
dc.identifier.urihttp://hdl.handle.net/11012/138174
dc.language.isoencs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 24th Conference STUDENT EEICT 2018en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.rights.accessopenAccessen
dc.subjectBrazingen
dc.subjectthick filmen
dc.subjectleachingen
dc.titleUsage Of Solders With Higher Melting Point For Hybrid Integrated Circuitsen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
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