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  • The Analysis of Solder Preforms in Surface Mount Assembly 

    Novotný, Václav; Vala, Radek (Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016)
    This article is focused on the sphere of solder joints reliability in technology of surface mount assembly and the issue of manufactory of solder joints with solder preforms is introduced closer. It also describes types ...