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  • Enhanced Method OF Through-hole Copper Plating 

    Otáhal, Alexandr; Crha, Adam; Šimek, Václav (Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016)
    This paper is dealing with an introduction of novel approach conceived towards the optimization of widespread through-hole copper plating process. Main objective in this context is to achieve significantly increased process ...