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dc.contributor.authorMašek, Jakub
dc.contributor.authorKoutný, Daniel
dc.contributor.authorPopela, Robert
dc.date.accessioned2019-01-11T11:17:55Z
dc.date.available2019-01-11T11:17:55Z
dc.date.issued2019cs
dc.identifier.citation13th Research and Education in Aircraft Design: Conference proceedings. s. 119-129. ISBN 978-80-214-5696-9cs
dc.identifier.isbn978-80-214-5696-9
dc.identifier.urihttp://hdl.handle.net/11012/137300
dc.description.abstractSelective Laser Melting (SLM) as part of the Additive manufacturing industry is a metal printing technology that is considered promising to address the thermal integrity defects of a Heat Switch – the space technology currently under development. However, no thermal conductivity data of SLMed copper alloy Cu7.2Ni1.8Si1Cr are freely available. Therefore, three parts were fabricated and tested in an experimental thermo-vacuum chamber to reveal the material thermal conductivity. The samples analogous to the Heat Switch components were: a disk with inner holes and two cylinders with thin-wall web of 0.325 mm and 1.625 mm. Based on the previous experience with the copper alloy, fabrication was successfully processed with up to 5 % dimensional accuracy according to CAD model. The thermal conductivity evaluation process was improved by the implementation of heat transfer by radiation and the calculated thermal conductivity of SLMed Cu7.2Ni1.8Si1Cr was 3.4 times lower than the value of bulk material AMPCOLOY 944 with a similar chemical composition.en
dc.formattextcs
dc.format.extent119-129cs
dc.format.mimetypeapplication/pdfen
dc.language.isoencs
dc.publisherVysoké učení technické v Brně, Fakulta strojního inženýrstvícs
dc.relation.ispartof13th Research and Education in Aircraft Design: Conference proceedingsen
dc.relation.urihttp://www.lu.fme.vutbr.cz/read2018cz/cs
dc.rightsCreative Commons Attribution 4.0 Internationalcs
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/cs
dc.subjectAdditive manufacturingen
dc.subjectSLM production accuracyen
dc.subjectCopper alloy Cu7.2Ni1.8Si1Cren
dc.subjectThin-wall structuresen
dc.subjectThermal conductivity testingen
dc.titleThermal conductivity of Cu7.2Ni1.8Si1Cr copper alloy produced via SLM and ability of thin-wall structure fabricationen
eprints.affiliatedInstitution.departmentFakulta strojního inženýrstvícs
but.event.date07.11.2018cs
but.event.title13th Research and Education in Aircraft Design Conference (READ 2018)cs
dc.identifier.doi10.13164/conf.read.2018.12
dc.rights.accessopenAccessen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionPublishers's versionen


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Creative Commons Attribution 4.0 International
Except where otherwise noted, this item's license is described as Creative Commons Attribution 4.0 International