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dc.contributor.authorRadvanský, Martin
dc.date.accessioned2020-04-16T07:19:28Z
dc.date.available2020-04-16T07:19:28Z
dc.date.issued2019cs
dc.identifier.citationProceedings of the 25st Conference STUDENT EEICT 2019. s. 102-104. ISBN 978-80-214-5735-5cs
dc.identifier.isbn978-80-214-5735-5
dc.identifier.urihttp://hdl.handle.net/11012/186628
dc.description.abstractDuring the development or repairing of electronic devices, we often meet problems with overheated components on the printed circuit board. For identification of overheating components, we usually use a thermal camera. The main aim of this project is to develop an inexpensive thermal camera for hobby usage.en
dc.formattextcs
dc.format.extent102-104cs
dc.format.mimetypeapplication/pdfen
dc.language.isocscs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 25st Conference STUDENT EEICT 2019en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.subjectThermal cameraen
dc.subjectPCBen
dc.subjectoverheatingen
dc.subjectRaspberry PIen
dc.titleShort Distance Thermal Camera For Overheat Detectionen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
but.event.date25.04.2019cs
but.event.titleStudent EEICT 2019cs
dc.rights.accessopenAccessen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen


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