The Analysis Of Ceramic Resistor Arrays In Smt
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Date
2017
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Mark
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Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract
This paper is focused on the area of current electrical manufactory in conjunction with possibilities of computer analysis and monitoring psychical phenomena by computing systems. There are also described processes of preparation and manufactory of testing boards for evaluation of reliability of solder joints on specific microelectronic part which has its place in contemporary electronic production and subsequent analysis of physical processes on these boards under condition of thermal cycling in thermal chamber and their influences on overall reliability of the entire component. For purposes of analysis were chosen SMD resistor arrays in configuration 8x0603 which were soldered on typical substrate FR-4 by SAC305 solder. These soldered resistor arrays are also modeled in Solidworks and analyzed by ANSYS. The results achieved by experimental measurement are complemented by simulations of models.
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Citation
Proceedings of the 23st Conference STUDENT EEICT 2017. s. 537-541. ISBN 978-80-214-5496-5
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
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Peer-reviewed
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en
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© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií