The Technology Of Ceramic Packages
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This paper deals with the technology of ceramic packages. The first part is about ceramic in general. The next part is focused on used material Nabaltec and advantages of this type of technology i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages of this technology step. The inspection was done by SEM pictures and shows the difference between sintered and unsintered ceramic. The last part is a simulation with 120mW power load and shows temperature distribution on the ceramic package compared with mold compound as the packaging material.
Document typePeer reviewed
Document versionxmlui.vut.verze.Publishers's version
SourceProceedings of the 23st Conference STUDENT EEICT 2017. s. 542-546. ISBN 978-80-214-5496-5
- Student EEICT 2017