Influence of Sub Structure Development within Rotary Swaged Al–Cu Clad Conductors on Skin Effect during Transfer of Alternating Current

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Date
2022-01-15
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Mark
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MDPI
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Abstract
The nature of alternating current transfer via metallic materials is specific, since the current density tends to be inhomogeneous across the cross-section of the conductor and the skin effect tends to occur. However, the influence of this effect on the behaviour of the conductor can be optimized via the design and fabrication procedures. The study presents innovative design of an Al–Cu clad conductor, which is supposed to affect favourably the influence of the skin effect. The clad conductors of various diameters (20 mm, 15 mm, and 10 mm) were fabricated via rotary swaging at room temperature, and their electric characteristics were subsequently examined both experimentally and via numerical simulations. Structure analyses performed to document the effects of the swaging technology on the development of substructure and characteristic structural features were carried out by scanning electron microscopy (electron backscatter diffraction analyses), and transmission electron microscopy. The results showed that the design of the composite has a favourable effect on decreasing the power losses during alternating current transfer and that the substructure development affected favourably the electric resistance of the conductor. The highest electric resistance was measured for the composite conductor with the diameter of 20 mm (1.8% increase compared to electric resistance during transfer of direct current). This value then decreased to 0.6%, and 0.1% after swaging down to the diameters of 15 mm, and 10 mm; the 10 mm composite featured the finest grains, partially restored structure, and texture randomization compared to the 20 mm and 15 mm composites. Manufacturing of the clad composite via rotary swaging imparted advantageous combinations of both the electric and mechanical properties, as swaging also introduced increased microhardness
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Materials . 2022, vol. 15, issue 2, p. 1-19.
https://www.mdpi.com/1996-1944/15/2/650
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Peer-reviewed
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en
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Creative Commons Attribution 4.0 International
http://creativecommons.org/licenses/by/4.0/
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