Browsing 2012/2 by Author "Podzemsky, J."

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Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys

Podzemsky, J.; Papez, V.; Urbanek, J.; Dusek, K. (Společnost pro radioelektronické inženýrství, 2012-06)

During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence of intermetallic ...