Simulation of Heat Transfer in Low-Voltage Switchboard MNS

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Date
2015
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Mark
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Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract
The content of this work is the diagnosis of the temperature profile of industrial low voltage switchboards. Place of origin, flow and heat dissipation are important aspects in the design of the cabinet, particularly with regard to the layout of your devices. The correctness of the design cabinet can be verified by measuring the temperature field practical cabinet during testing or in work mode. Another option is to simulate the temperature profile of the low voltage. This can prevent waste of materials and saving money for the development
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Proceedings of the 21st Conference STUDENT EEICT 2015. s. 268-270. ISBN 978-80-214-5148-3
http://www.feec.vutbr.cz/EEICT/
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Peer-reviewed
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cs
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© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
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