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dc.contributor.authorJaníček, M.
dc.date.accessioned2015-08-25T08:43:00Z
dc.date.available2015-08-25T08:43:00Z
dc.date.issued2015cs
dc.identifier.citationProceedings of the 21st Conference STUDENT EEICT 2015. s. 274-276. ISBN 978-80-214-5148-3cs
dc.identifier.isbn978-80-214-5148-3
dc.identifier.urihttp://hdl.handle.net/11012/42999
dc.description.abstractThis paper deals with effects, which can affect solder joints quality. It also evaluates experiments which were made. These experiments were connected with fluxes problematic. First there are mentioned effects connected with amount of flux, and then experiments were focused to ways of applying the flux. Next steps are mentioned at the end of the paper.en
dc.formattextcs
dc.format.extent274-276cs
dc.format.mimetypeapplication/pdfen
dc.language.isocscs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 21st Conference STUDENT EEICT 2015en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.subjectBGAen
dc.subjectfluxen
dc.subjectrepairen
dc.subjectIR solderingen
dc.titleEffects Affecting BGA Solderingen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
but.event.date23.04.2015cs
but.event.titleStudent EEICT 2015cs
dc.rights.accessopenAccessen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen


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