Detection of defect on FBGA solder balls using X-ray technology
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Date
2015
Authors
ORCID
Advisor
Referee
Mark
Journal Title
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Volume Title
Publisher
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract
The paper deals with the detection of defects using X-ray technology. It is focused on a particular type of X-ray machine, which is used for most of these experiments. X-ray cabinet is commonly used for analyzes of defects, which are formed during soldering process. Paper also includes an introduction of different types of defects. These defects are serious issue and they can cause malfunction of infected components or of the entire device. That is the main reason it is so important to focus on this issue.
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Citation
Proceedings of the 21st Conference STUDENT EEICT 2015. s. 391-395. ISBN 978-80-214-5148-3
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
Document type
Peer-reviewed
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Published version
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Language of document
en
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Defence
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© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií