Reduction of EMC Emissions in Mixed Signal Integrated Circuits with Embedded LIN Driver
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This paper describes several methods for reduction of electromagnetic emissions (EME) of mixed signal integrated circuits (IC). The focus is on the impact that a LIN bus communication block has on a complex IC which contains analog blocks, noisy digital block, micro-core (µC) and several types of memories. It is used in an automotive environment, where EMC emission reduction is one of the key success factors. Several proposed methods for EME reduction are described and implemented on three test chips. These methods include current consumption reduction, internal on-chip decoupling, ground separation and different linear voltage regulator topologies. Measurement results of several fabricated test chips are shown and discussed.
KeywordsEMC, emissions, ground splitting, linear voltage regulator, automotive industry, LIN bus driver
Document typePeer reviewed
Document versionFinal PDF
SourceRadioengineering. 2016 vol. 25, č. 2, s. 345-350. ISSN 1210-2512
- 2016/2