Substrate Integrated Waveguide Cavity Filters: Miniaturization and New Materials for IoT Applications
Loading...
Date
2017-09
Authors
ORCID
Advisor
Referee
Mark
Journal Title
Journal ISSN
Volume Title
Publisher
Společnost pro radioelektronické inženýrství
Altmetrics
Abstract
This paper presents an overview of the current research trends in the field of substrate integrated waveguide (SIW) technology, with particular emphasis on the issues related to the emerging applications in the framework of the Internet of Things (IoT) and the fifth generation of mobile communication (5G). More specifically, different techniques adopted to miniaturize SIW cavities are described, with the aim of reducing the footprint of SIW components and filters. Moreover, the use of innovative materials, like paper, textile and 3D printed dielectric substrates, is presented and discussed, and the implementation of ecofriendly, wearable, and fully 3D structures is illustrated.
Description
Citation
Radioengineering. 2017 vol. 26, č. 3, s. 633-641. ISSN 1210-2512
https://www.radioeng.cz/fulltexts/2017/17_03_0633_0641.pdf
https://www.radioeng.cz/fulltexts/2017/17_03_0633_0641.pdf
Document type
Peer-reviewed
Document version
Published version
Date of access to the full text
Language of document
en