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  • Analysis of Defects on PCB Using X-RAY, 3D SW CERA and Micro-Sections 

    Vala, Martin (Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016)
    This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. ...