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dc.contributor.authorStarčok, Tomáš
dc.date.accessioned2018-07-10T12:48:15Z
dc.date.available2018-07-10T12:48:15Z
dc.date.issued2016cs
dc.identifier.citationProceedings of the 22nd Conference STUDENT EEICT 2016. s. 237-239. ISBN 978-80-214-5350-0cs
dc.identifier.isbn978-80-214-5350-0
dc.identifier.urihttp://hdl.handle.net/11012/83928
dc.description.abstractThis paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.en
dc.formattextcs
dc.format.extent237-239cs
dc.format.mimetypeapplication/pdfen
dc.language.isoskcs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 22nd Conference STUDENT EEICT 2016en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.subjectBGAen
dc.subjectsolderen
dc.subjectresiduesen
dc.subjectreworken
dc.titleStreamlining the Process of Cleaning PCB after Removing BGAen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
but.event.date28.04.2016cs
but.event.titleStudent EEICT 2016cs
dc.rights.accessopenAccessen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen


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