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dc.contributor.authorOtáhal, Alexandr
dc.contributor.authorCrha, Adam
dc.contributor.authorŠimek, Václav
dc.date.accessioned2018-07-10T12:48:20Z
dc.date.available2018-07-10T12:48:20Z
dc.date.issued2016cs
dc.identifier.citationProceedings of the 22nd Conference STUDENT EEICT 2016. s. 610-614. ISBN 978-80-214-5350-0cs
dc.identifier.isbn978-80-214-5350-0
dc.identifier.urihttp://hdl.handle.net/11012/84005
dc.description.abstractThis paper is dealing with an introduction of novel approach conceived towards the optimization of widespread through-hole copper plating process. Main objective in this context is to achieve significantly increased process reliability and overall fabrication yield also for the smallscale production runs or prototyping purposes of printed circuit boards. Essential aspect of the procedure outlined in this paper is inherently connected with the activation of printed circuit board surface, which serves as the basis for the subsequent step that involves the conformal copper plating of holes drilled through the substrate compound. An innovative part of the whole process can be recognized in activation of drilled holes surface by means of employing combination of vacuum (low pressure environment) and ultrasound within the dedicated setup. The application of the suggested procedure helps to considerably reduce the failure ratio (i.e. the presence of holes with faulty surface plating) even in case of drilled holes at considerably small dimensions and, as a direct consequence, improves the overall process reliability.en
dc.formattextcs
dc.format.extent610-614cs
dc.format.mimetypeapplication/pdfen
dc.language.isoencs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 22nd Conference STUDENT EEICT 2016en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.subjectThrough-hole technologyen
dc.subjectcopper platingen
dc.subjectPCBen
dc.titleEnhanced Method OF Through-hole Copper Platingen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
but.event.date28.04.2016cs
but.event.titleStudent EEICT 2016cs
dc.rights.accessopenAccessen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionPublishers's versionen


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