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  • Design Of Reflow Soldering Station For Reballing Of Bga Packages 

    Janiš, Adam (Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2018)
    This article deals with the design of a soldering oven for BGA reballing in a nitrogen atmosphere. The principles of reflow soldering, the advantages of a nitrogen atmosphere regarding the quality of solder joints and the ...