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dc.contributor.authorTomassoni, C.
dc.contributor.authorBozzi, M.
dc.date.accessioned2020-05-04T09:39:02Z
dc.date.available2020-05-04T09:39:02Z
dc.date.issued2020-04cs
dc.identifier.citationRadioengineering. 2020 vol. 29, č. 1, s. 1-9. ISSN 1210-2512cs
dc.identifier.issn1210-2512
dc.identifier.urihttp://hdl.handle.net/11012/186928
dc.description.abstractThis paper presents an overview of the use of additive manufacturing (AM) technologies for the implementation of microwave components. Two major technological solutions, based on the AM of plastic materials, are discussed: in the former case, the AM plastic is used as a dielectric material that constitutes the component. Conversely, in the latter case, the plastic material is a mere support of the metallization, thus avoiding the contact of the AM plastic with the electromagnetic field and reducing losses. Several examples are illustrated and discussed, to highlight benefits and limitations of AM techniques in the current scenario of microwave applications.en
dc.formattextcs
dc.format.extent1-9cs
dc.format.mimetypeapplication/pdfen
dc.language.isoencs
dc.publisherSpolečnost pro radioelektronické inženýrstvícs
dc.relation.ispartofRadioengineeringcs
dc.relation.urihttps://www.radioeng.cz/fulltexts/2020/20_01_0001_0009.pdfcs
dc.rightsCreative Commons Attribution 4.0 International licenseen
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/en
dc.subjectAdditeve manufacturingen
dc.subjectmicrowave componentsen
dc.subjectmicrowave filtersen
dc.subjectslab waveguidesen
dc.subjectmicrowave sensorsen
dc.titleMicrowave Components Realized by Additive Manufacturing Techniquesen
eprints.affiliatedInstitution.facultyFakulta eletrotechniky a komunikačních technologiícs
dc.coverage.issue1cs
dc.coverage.volume29cs
dc.identifier.doi10.13164/re.2020.0001en
dc.rights.accessopenAccessen
dc.type.driverarticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen


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Creative Commons Attribution 4.0 International license
Except where otherwise noted, this item's license is described as Creative Commons Attribution 4.0 International license