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  • Thermomechanical simulation of modern electronic packages 

    Skácel, J. (Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2015)
    This paper deals with issue of modern electronic packages mainly thermo-mechanical simulation. The first part is focused on the comparing of QFN (Quad-Flat No leads) and BGA (Ball Grid Array) packages including their ...