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dc.contributor.authorCzudek, A.
dc.date.accessioned2015-08-25T08:42:59Z
dc.date.available2015-08-25T08:42:59Z
dc.date.issued2015cs
dc.identifier.citationProceedings of the 21st Conference STUDENT EEICT 2015. s. 268-270. ISBN 978-80-214-5148-3cs
dc.identifier.isbn978-80-214-5148-3
dc.identifier.urihttp://hdl.handle.net/11012/42997
dc.description.abstractThe content of this work is the diagnosis of the temperature profile of industrial low voltage switchboards. Place of origin, flow and heat dissipation are important aspects in the design of the cabinet, particularly with regard to the layout of your devices. The correctness of the design cabinet can be verified by measuring the temperature field practical cabinet during testing or in work mode. Another option is to simulate the temperature profile of the low voltage. This can prevent waste of materials and saving money for the developmenten
dc.formattextcs
dc.format.extent268-270cs
dc.format.mimetypeapplication/pdfen
dc.language.isocscs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 21st Conference STUDENT EEICT 2015en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.subjectSolidWorksen
dc.subjectFlow Simulationen
dc.subjectPDMen
dc.subjectPLMen
dc.subjectCADen
dc.subjectABBen
dc.subjectSACEen
dc.subjectEmaxen
dc.subjectEmax 2en
dc.subjectbreakeren
dc.subjectswitchgearen
dc.subjectsimulationen
dc.titleSimulation of Heat Transfer in Low-Voltage Switchboard MNSen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
but.event.date23.04.2015cs
but.event.titleStudent EEICT 2015cs
dc.rights.accessopenAccessen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen


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