Show simple item record

dc.contributor.authorMlýnek, M.
dc.date.accessioned2015-08-25T08:43:00Z
dc.date.available2015-08-25T08:43:00Z
dc.date.issued2015cs
dc.identifier.citationProceedings of the 21st Conference STUDENT EEICT 2015. s. 286-288. ISBN 978-80-214-5148-3cs
dc.identifier.isbn978-80-214-5148-3
dc.identifier.urihttp://hdl.handle.net/11012/43003
dc.description.abstractUsing x – ray is one way for analyzing structural defects on PCB and lead components. X – Plane method is based on making individual 2D slices within a sample from top to bottom, front to back and left to right. There is no need to cut or destroy sample. X – Plane method works at high magnification. Method is showing position and size of voids or cracks, identifying head on pillow, open joint and other defects.en
dc.formattextcs
dc.format.extent286-288cs
dc.format.mimetypeapplication/pdfen
dc.language.isocscs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 21st Conference STUDENT EEICT 2015en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.subjectX – planeen
dc.subjectX – rayen
dc.subjectdefecten
dc.subjectanalysisen
dc.titleAnalysis of Defects on PCB Using X - Plane Methoden
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
but.event.date23.04.2015cs
but.event.titleStudent EEICT 2015cs
dc.rights.accessopenAccessen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record