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dc.contributor.authorSkácel, J.
dc.date.accessioned2015-08-25T08:43:00Z
dc.date.available2015-08-25T08:43:00Z
dc.date.issued2015cs
dc.identifier.citationProceedings of the 21st Conference STUDENT EEICT 2015. s. 289-291. ISBN 978-80-214-5148-3cs
dc.identifier.isbn978-80-214-5148-3
dc.identifier.urihttp://hdl.handle.net/11012/43004
dc.description.abstractThis paper deals with issue of modern electronic packages mainly thermo-mechanical simulation. The first part is focused on the comparing of QFN (Quad-Flat No leads) and BGA (Ball Grid Array) packages including their advantages and disadvantages. The second part is focused on simulation of these packages in ANSYS program from the point of thermos-mechanical behavior.en
dc.formattextcs
dc.format.extent289-291cs
dc.format.mimetypeapplication/pdfen
dc.language.isocscs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 21st Conference STUDENT EEICT 2015en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.subjectANSYSen
dc.subjectBGAen
dc.subjectQFNen
dc.subjectthermo-mechanical behavioren
dc.titleThermomechanical simulation of modern electronic packagesen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
but.event.date23.04.2015cs
but.event.titleStudent EEICT 2015cs
dc.rights.accessopenAccessen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen


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