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dc.contributor.authorNovotný, V.
dc.date.accessioned2015-08-25T08:43:03Z
dc.date.available2015-08-25T08:43:03Z
dc.date.issued2015cs
dc.identifier.citationProceedings of the 21st Conference STUDENT EEICT 2015. s. 381-385. ISBN 978-80-214-5148-3cs
dc.identifier.isbn978-80-214-5148-3
dc.identifier.urihttp://hdl.handle.net/11012/43028
dc.description.abstractThis article deals with the sphere of solder joints reliability and narrower focus is using simulation software ANSYS and fatigue models for estimate reliabity of solder joints. The text describes the introduction to the issue of the reliability of soldered connections and important factors with their influences. Then are described some options for prediction of reliability. This includes the issue of fatigue models and design of simulation in simulating software ANSYS. In conclusion, there are described output of simulations and options for calculation by fatigue models.en
dc.formattextcs
dc.format.extent381-385cs
dc.format.mimetypeapplication/pdfen
dc.language.isoencs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 21st Conference STUDENT EEICT 2015en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.subjectEEICTen
dc.subjectANSYSen
dc.subjectReliabilityen
dc.subjectSimulationen
dc.subjectSolder jointsen
dc.subjectfatigue modelsen
dc.titleAnalysis and Prediction of Reliability of Solder Jointsen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
but.event.date23.04.2015cs
but.event.titleStudent EEICT 2015cs
dc.rights.accessopenAccessen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen


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