Modeling the Substrate Skin Effects in Mutual RL Characteristics.,
Alternativní metriky PlumXhttp://hdl.handle.net/11012/58115
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The goal of this work was to model the influence of the substrate skin effects on the distributed mutual impedance per unit length parameters of multiple coupled on-chip interconnects. The proposed analytic model is based on the frequency-dependent distribution of the current in the silicon substrate and the closed form integration approach. It is shown that the calculated frequency-dependent distributed mutual inductance and the associated mutual resistance are in good agreement with the results obtained from CAD-oriented circuit modeling technique.
Typ dokumentuRecenzovaný dokument
Zdrojový dokumentRadioengineering. 2003, vol. 12, č. 4, s. 21-25. ISSN 1210-2512
- 2003/4