Design and simulation of solutions to reduce the thermal resistance of lighting systems
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Date
2019-10-29
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Referee
Mark
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Publisher
IFAC
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Abstract
The paper focuses on some essential steps in the development of high power line light. The research within the solved project deals with the development of a special extruded profile with a cooling channel and with heat removal by the circulation of the coolant and on the design of a cooling system with all the safety elements. The partial aim of the work is to determine the thermal resistance of individual parts of the device and to design modifications so that the total thermal resistance and maximum temperature are within the limits set by the effort to achieve maximum light output, but also the longevity, economy, safety, and reliability of operation. The analytical calculations, CFD simulations, and real testing were used to determine the required parameters. The main result presented in this paper is a novel developed PCB with a copper core and thermal vias. (C) 2019, IFAC (International Federation of Automatic Control) Hosting by Elsevier Ltd. All rights reserved.
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Citation
IFAC-PapersOnLine (ELSEVIER). 2019, vol. 52, issue 27, p. 446-452.
https://www.sciencedirect.com/science/article/pii/S2405896319326539
https://www.sciencedirect.com/science/article/pii/S2405896319326539
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Peer-reviewed
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Published version
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en
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Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International
http://creativecommons.org/licenses/by-nc-nd/4.0/
http://creativecommons.org/licenses/by-nc-nd/4.0/