Optimization And Investigation Of The Free Air Ball Formation Of The Gold Wire Bond
Loading...
Date
2020
Authors
ORCID
Advisor
Referee
Mark
Journal Title
Journal ISSN
Volume Title
Publisher
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract
This paper deals with Free air ball (FAB) formation and its optimization. It is part of the thermocompression of the thermosonic wire bonding process. This paper consists of a theoretical introduction to the topic and specific technological steps that is crucial for correct FAB formation. Technological parameters that can have an impact on the FAB formation process were analyzed. These are for example power of the electric discharge, length of the wire tail or protective atmosphere in the case of corrosive materials of the wire. The impact of these parameters on the quality of the reliability of the FAB and the wire-bonded joint were evaluated. At the end of this paper is a recommendation for the optimization of the wire bonding process for the small amount of the semiconductor chips.
Description
Citation
Proceedings I of the 26st Conference STUDENT EEICT 2020: General papers. s. 473-477. ISBN 978-80-214-5867-3
https://conf.feec.vutbr.cz/eeict/EEICT2020
https://conf.feec.vutbr.cz/eeict/EEICT2020
Document type
Peer-reviewed
Document version
Published version
Date of access to the full text
Language of document
en
Study field
Comittee
Date of acceptance
Defence
Result of defence
Document licence
© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií