Microsolder controlled by microprocessor
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Date
2015
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Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract
The aim of this thesis is to design microsolder control, which can hold constant temperature of solder tip and description of hardware and firmware implementation. This solution allows the same function like classical microsolders but you can connect modern solder tip with high heat capacity. Other requirements are: switching frequency should be above the audible frequency, rotary encoder for temperature adjust, LCD display.
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Citation
Proceedings of the 21st Conference STUDENT EEICT 2015. s. 165-167. ISBN 978-80-214-5148-3
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
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Peer-reviewed
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cs
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© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií