Analysis of Defects on PCB Using X - Plane Method
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Date
2015
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Mark
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Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract
Using x – ray is one way for analyzing structural defects on PCB and lead components. X – Plane method is based on making individual 2D slices within a sample from top to bottom, front to back and left to right. There is no need to cut or destroy sample. X – Plane method works at high magnification. Method is showing position and size of voids or cracks, identifying head on pillow, open joint and other defects.
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Proceedings of the 21st Conference STUDENT EEICT 2015. s. 286-288. ISBN 978-80-214-5148-3
http://www.feec.vutbr.cz/EEICT/
http://www.feec.vutbr.cz/EEICT/
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Peer-reviewed
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cs
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© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií