Analysis and Prediction of Reliability of Solder Joints

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Date
2015
ORCID
Advisor
Referee
Mark
Journal Title
Journal ISSN
Volume Title
Publisher
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract
This article deals with the sphere of solder joints reliability and narrower focus is using simulation software ANSYS and fatigue models for estimate reliabity of solder joints. The text describes the introduction to the issue of the reliability of soldered connections and important factors with their influences. Then are described some options for prediction of reliability. This includes the issue of fatigue models and design of simulation in simulating software ANSYS. In conclusion, there are described output of simulations and options for calculation by fatigue models.
Description
Citation
Proceedings of the 21st Conference STUDENT EEICT 2015. s. 381-385. ISBN 978-80-214-5148-3
http://www.feec.vutbr.cz/EEICT/
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Peer-reviewed
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Published version
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Language of document
en
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Date of acceptance
Defence
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© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
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Citace PRO