Modeling the Substrate Skin Effects in Mutual RL Characteristics.,
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Date
2003-12
ORCID
Advisor
Referee
Mark
Journal Title
Journal ISSN
Volume Title
Publisher
Společnost pro radioelektronické inženýrství
Abstract
The goal of this work was to model the influence of the substrate skin effects on the distributed mutual impedance per unit length parameters of multiple coupled on-chip interconnects. The proposed analytic model is based on the frequency-dependent distribution of the current in the silicon substrate and the closed form integration approach. It is shown that the calculated frequency-dependent distributed mutual inductance and the associated mutual resistance are in good agreement with the results obtained from CAD-oriented circuit modeling technique.
Description
Citation
Radioengineering. 2003, vol. 12, č. 4, s. 21-25. ISSN 1210-2512
http://www.radioeng.cz/fulltexts/2003/03_04_21_25.pdf
http://www.radioeng.cz/fulltexts/2003/03_04_21_25.pdf
Document type
Peer-reviewed
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Published version
Date of access to the full text
Language of document
en