Optimization And Investigation Of The Free Air Ball Formation Of The Gold Wire Bond

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but.event.date23.04.2020cs
but.event.titleStudent EEICT 2020cs
dc.contributor.authorBúran, Martin
dc.date.accessioned2021-07-15T11:17:17Z
dc.date.available2021-07-15T11:17:17Z
dc.date.issued2020cs
dc.description.abstractThis paper deals with Free air ball (FAB) formation and its optimization. It is part of the thermocompression of the thermosonic wire bonding process. This paper consists of a theoretical introduction to the topic and specific technological steps that is crucial for correct FAB formation. Technological parameters that can have an impact on the FAB formation process were analyzed. These are for example power of the electric discharge, length of the wire tail or protective atmosphere in the case of corrosive materials of the wire. The impact of these parameters on the quality of the reliability of the FAB and the wire-bonded joint were evaluated. At the end of this paper is a recommendation for the optimization of the wire bonding process for the small amount of the semiconductor chips.en
dc.formattextcs
dc.format.extent473-477cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationProceedings I of the 26st Conference STUDENT EEICT 2020: General papers. s. 473-477. ISBN 978-80-214-5867-3cs
dc.identifier.isbn978-80-214-5867-3
dc.identifier.urihttp://hdl.handle.net/11012/200509
dc.language.isoencs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings I of the 26st Conference STUDENT EEICT 2020: General papersen
dc.relation.urihttps://conf.feec.vutbr.cz/eeict/EEICT2020cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.rights.accessopenAccessen
dc.subjectFree air ballen
dc.subjectoptimizationen
dc.subjectgolden
dc.subjectsilveren
dc.subjectwire tailen
dc.subjectdischargeen
dc.titleOptimization And Investigation Of The Free Air Ball Formation Of The Gold Wire Bonden
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
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