Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys

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dc.contributor.authorPodzemsky, Jiri
dc.contributor.authorPapez, Vaclav
dc.contributor.authorUrbanek, Jan
dc.contributor.authorDusek, Karel
dc.coverage.issue2cs
dc.coverage.volume21cs
dc.date.accessioned2015-01-22T11:09:04Zcs_CZ
dc.date.accessioned2015-01-22T14:14:52Z
dc.date.available2015-01-22T11:09:04Zcs_CZ
dc.date.available2015-01-22T14:14:52Z
dc.date.issued2012-06cs
dc.description.abstractDuring soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence of intermetallic compounds (IMC) on radio frequency resistance of soldered joint has been identified. Tested solders were lead free Sn-1Cu, Sn-4Ag and Sn-3.8Ag-0.7Cu and lead containing Sn-37Pb (all in weight percent). Samples were annealed up to 3000 hours at 150 °C to accelerated growing of IMC. Radio frequency measuring method has been developed and is described. Influence of IMC on resistance of joint is growing with growing frequency because IMC with slightly different resistivity to base solder is creating barrier to current. Resistance of joints has been measured up to 3 GHz.en
dc.formattextcs
dc.format.extent573-579cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationRadioengineering. 2012, vol. 21, č. 2, s. 573-579. ISSN 1210-2512cs
dc.identifier.issn1210-2512cs_CZ
dc.identifier.urihttp://hdl.handle.net/11012/37097cs_CZ
dc.language.isoencs
dc.publisherSpolečnost pro radioelektronické inženýrstvícs
dc.relation.ispartofRadioengineeringcs
dc.relation.urihttp://www.radioeng.cz/fulltexts/2012/12_02_0573_0579.pdfcs
dc.rightsCreative Commons Attribution 3.0 Unported Licenseen
dc.rights.accessopenAccessen
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/en
dc.subjectRF resistanceen
dc.subjectintermetallic compoundsen
dc.subjectlead free alloysen
dc.titleInfluence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloysen
dc.type.driverarticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.facultyFakulta eletrotechniky a komunikačních technologiícs
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