Phase Change Materials for Thermal Management of IC Packages

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dc.contributor.authorBehunek, Ivo
dc.contributor.authorFiala, Pavel
dc.coverage.issue2cs
dc.coverage.volume16cs
dc.date.accessioned2016-03-24T06:43:20Z
dc.date.available2016-03-24T06:43:20Z
dc.date.issued2007-06cs
dc.description.abstractThis paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of a real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.en
dc.formattextcs
dc.format.extent50-55cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationRadioengineering. 2007, vol. 16, č. 2, s. 50-55. ISSN 1210-2512cs
dc.identifier.issn1210-2512
dc.identifier.urihttp://hdl.handle.net/11012/57288
dc.language.isoencs
dc.publisherSpolečnost pro radioelektronické inženýrstvícs
dc.relation.ispartofRadioengineeringcs
dc.relation.urihttp://www.radioeng.cz/fulltexts/2007/07_02_50_55.pdfcs
dc.rightsCreative Commons Attribution 3.0 Unported Licenseen
dc.rights.accessopenAccessen
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/en
dc.subjectPhase changeen
dc.subjectFEMen
dc.subjectheaten
dc.subjectintegrated circuiten
dc.titlePhase Change Materials for Thermal Management of IC Packagesen
dc.type.driverarticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.facultyFakulta eletrotechniky a komunikačních technologiícs
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