Phase Change Materials for Thermal Management of IC Packages
Abstract
This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of a real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.
Keywords
Phase change, FEM, heat, integrated circuitPersistent identifier
http://hdl.handle.net/11012/57288Document type
Peer reviewedDocument version
Final PDFSource
Radioengineering. 2007, vol. 16, č. 2, s. 50-55. ISSN 1210-2512http://www.radioeng.cz/fulltexts/2007/07_02_50_55.pdf
Collections
- 2007/2 [13]
Citace PRO
Except where otherwise noted, this item's license is described as Creative Commons Attribution 3.0 Unported License