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dc.contributor.authorVala, Martin
dc.date.accessioned2018-07-10T12:48:14Z
dc.date.available2018-07-10T12:48:14Z
dc.date.issued2016cs
dc.identifier.citationProceedings of the 22nd Conference STUDENT EEICT 2016. s. 206-208. ISBN 978-80-214-5350-0cs
dc.identifier.isbn978-80-214-5350-0
dc.identifier.urihttp://hdl.handle.net/11012/83918
dc.description.abstractThis paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg.: modern X-ray defect detection.en
dc.formattextcs
dc.format.extent206-208cs
dc.format.mimetypeapplication/pdfen
dc.language.isocscs
dc.publisherVysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.relation.ispartofProceedings of the 22nd Conference STUDENT EEICT 2016en
dc.relation.urihttp://www.feec.vutbr.cz/EEICT/cs
dc.rights© Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologiícs
dc.subjectX-rayen
dc.subjectDefecten
dc.subjectAnalysisen
dc.subjectX-planeen
dc.subjectVoiden
dc.titleAnalysis of Defects on PCB Using X-RAY, 3D SW CERA and Micro-Sectionsen
eprints.affiliatedInstitution.departmentFakulta elektrotechniky a komunikačních technologiícs
but.event.date28.04.2016cs
but.event.titleStudent EEICT 2016cs
dc.rights.accessopenAccessen
dc.type.driverconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen


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