Detection of defect on FBGA solder balls using X-ray technology
| but.event.date | 23.04.2015 | cs |
| but.event.title | Student EEICT 2015 | cs |
| dc.contributor.author | Řihák, P. | |
| dc.date.accessioned | 2015-08-25T08:43:03Z | |
| dc.date.available | 2015-08-25T08:43:03Z | |
| dc.date.issued | 2015 | cs |
| dc.description.abstract | The paper deals with the detection of defects using X-ray technology. It is focused on a particular type of X-ray machine, which is used for most of these experiments. X-ray cabinet is commonly used for analyzes of defects, which are formed during soldering process. Paper also includes an introduction of different types of defects. These defects are serious issue and they can cause malfunction of infected components or of the entire device. That is the main reason it is so important to focus on this issue. | en |
| dc.format | text | cs |
| dc.format.extent | 391-395 | cs |
| dc.format.mimetype | application/pdf | en |
| dc.identifier.citation | Proceedings of the 21st Conference STUDENT EEICT 2015. s. 391-395. ISBN 978-80-214-5148-3 | cs |
| dc.identifier.isbn | 978-80-214-5148-3 | |
| dc.identifier.uri | http://hdl.handle.net/11012/43030 | |
| dc.language.iso | en | cs |
| dc.publisher | Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií | cs |
| dc.relation.ispartof | Proceedings of the 21st Conference STUDENT EEICT 2015 | en |
| dc.relation.uri | http://www.feec.vutbr.cz/EEICT/ | cs |
| dc.rights | © Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií | cs |
| dc.rights.access | openAccess | en |
| dc.title | Detection of defect on FBGA solder balls using X-ray technology | en |
| dc.type.driver | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
| eprints.affiliatedInstitution.department | Fakulta elektrotechniky a komunikačních technologií | cs |