MIMO Antenna H-Plane Isolation Enhancement using UC-EBG Structure and Metal Line Strip for WLAN Applications

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dc.contributor.authorKumar, Niraj
dc.contributor.authorKommuri, Usha Kiran
dc.coverage.issue2cs
dc.coverage.volume28cs
dc.date.accessioned2020-04-30T10:34:53Z
dc.date.available2020-04-30T10:34:53Z
dc.date.issued2019-06cs
dc.description.abstractThis paper presents design of novel uniplanar Compact Electromagnetic bandgap (EBG) structure and its application in enhancement of isolation in H-Plane of MIMO antenna system for WLAN (5.8 GHz). Isolation enhancement or coupling reduction of 5.6 dB is achieved by etching out the proposed EBG structure from the ground plane of microstrip patch MIMO antenna. Center to center distance is reduced to 0.45λo due to compactness of EBG. A metal line strip between radiating patches is used for further reduction in mutual coupling at 5.8 GHz. There is significant enhancement of 16.2 dB in isolation due to the introduction of metal line strip. Hence the total 21.8 dB reduction in mutual coupling is achieved and this coupling reduction is also verified by surface current plots and measured result. The envelope correlation coefficient (ECC) is less than 0.01 and channel capacity loss (CCL) is less than 0.1bps/Hz at operating frequency.en
dc.formattextcs
dc.format.extent399-406cs
dc.format.mimetypeapplication/pdfen
dc.identifier.citationRadioengineering. 2019 vol. 28, č. 2, s. 399-406. ISSN 1210-2512cs
dc.identifier.doi10.13164/re.2019.0399en
dc.identifier.issn1210-2512
dc.identifier.urihttp://hdl.handle.net/11012/186874
dc.language.isoencs
dc.publisherSpolečnost pro radioelektronické inženýrstvícs
dc.relation.ispartofRadioengineeringcs
dc.relation.urihttps://www.radioeng.cz/fulltexts/2019/19_02_0399_0406.pdfcs
dc.rightsCreative Commons Attribution 4.0 International licenseen
dc.rights.accessopenAccessen
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/en
dc.subjectElectromagnetic Band Gap (EBG)en
dc.subjectMIMO antennaen
dc.subjectmutual couplingen
dc.titleMIMO Antenna H-Plane Isolation Enhancement using UC-EBG Structure and Metal Line Strip for WLAN Applicationsen
dc.type.driverarticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen
eprints.affiliatedInstitution.facultyFakulta eletrotechniky a komunikačních technologiícs
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